Lako Mana RF/Sputtering

Hilinaʻi ka lako mana RF moʻo RHH i ka ʻenehana hanauna RF makua e hāʻawi i nā mea kūʻai aku me ka lako mana RF me ka mana nui aʻe, ka pololei kiʻekiʻe a me ka pane wikiwiki. Hiki ke hoʻonohonoho ʻia me ka pae, ka pulse controllable, ka hoʻonohonoho kikohoʻe a me nā hana ʻē aʻe. Nā kahua pili: ʻoihana photovoltaic, ʻoihana hōʻike panela pālahalaha, ʻoihana semiconductor, ʻoihana kemika, keʻena hoʻokolohua, noiʻi ʻepekema, hana ʻana, a pēlā aku.
Nā kaʻina hana pili: plasma enhanced chemical vapor deposition (PECVD), plasma etching, plasma cleaning, radio frequency ion source, plasma diffusion, plasma polymerization sputtering, reactive sputtering, etc.

Hoʻohana ka mana mana RF moʻo RLS i ka mea hoʻoikaika mana paʻa a hilinaʻi hoʻi o kēia manawa a me ka ʻōnaehana mana DC koʻikoʻi o ka hui, no laila he hana paʻa loa ka huahana a me ka hilinaʻi huahana kiʻekiʻe. Hoʻohana i ka interface hōʻike Kina a me Pelekane, maʻalahi e hana. Hoʻohana nui ʻia i ka ʻoihana photovoltaic, ʻoihana hōʻike panela pālahalaha, ʻoihana semiconductor, ʻoihana kemika, keʻena hoʻokolohua, noiʻi ʻepekema, hana ʻana, a pēlā aku.

Hiki ke hoʻololi ʻia i ka lako mana RF moʻo RLS, a hoʻohana nui ʻia i ka etching plasma, coating, hoʻomaʻemaʻe plasma, degumming plasma a me nā kaʻina hana ʻē aʻe. Ke hoʻohana wale ʻia, hiki ke hoʻohana pū ʻia me nā lako mana RF o nā mea hana ʻē aʻe.

Hoʻohana ka mana hoʻolako sputtering DC moʻo MSD i ka ʻōnaehana hoʻokele DC koʻikoʻi o ka hui i hui pū ʻia me ka hoʻolālā hana arc maikaʻi loa, no laila he hana paʻa loa ka huahana, hilinaʻi kiʻekiʻe o ka huahana, hōʻino arc liʻiliʻi a me ka hana hou maikaʻi. Hoʻohana i ka interface hōʻike Kina a me Pelekane, maʻalahi e hoʻohana.